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SI-BWG-1
The SI-BWG-1 is a low viscosity, high temperature resin system developed for use in the resin transfer molding (RTM) process. The resin system is processible at room temperature.
| Thermal Property | Test Method | Units | Value |
| Onset Temperature (DSC) | ASTM D-3418 | °C(°F) | 186.11(367) |
| Heat of Reaction (DSC) | ASTM D-3418 | J/g | 319 |
| Glass Transition (DMA) | ASTM D-4065 | °C(°F) | 444.44(832) |
| Coefficient of Thermal Expansion (TMA) | ASTM D-3386 | µ/°C | 43.56 |
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A.T.A.R.D. Laboratories
SISRAC International
TechChem
Precision Composites
Products
Glossary
Contact
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A.T.A.R.D. Laboratories
SISRAC International
TechChem
Precision Composites
Products
Glossary
Contact
Home
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